BOND (FUNGICIDE)

BOND 007 (Tebuconzole 25.9% EC)

  • It has an excellent Protective, Curative & Eradicative Efficacy.
  • Bond has fast absorption giving better action against diseases.
  • It is a broad spectrum activity fungicide against no. of diseases.
  • Excellent plant growth effect.
  • Improves quality of produce.
  • Application of Bond results in greening effect on the crop foliage.
  • Bond controls dirty panicle on paddy with grain shine.
  • Controls complex of diseases on Chilli & Groundnut.

Hpm presents #Bond 007 #(FUNGICIDE)

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